Wire Pulling and Chip Welding Di Card Making Line

• Customization: Available
• Throughput: 3,500 Cards/H
• Card Dimension: 86mm*54mm
• Model NO.: HDTX3500 & HDHF3500
• Card Thickness: 0.76mm-1mm
• Total Power: 10kw
• Power Supply: ~220V 50/60Hz
• Ambient Temperature: 0-40 Degree
• Humidity: 15~90%
• out-Line Dimension: 6500×1000×1750mm
• Transport Package: Packed in Strong Fumigated Wooden Case
• Specification: CE
• Trademark: Mingsen
• Origin: China
• HS Code: 8479899990

Product Description

This type of dual interface card making technology is long time proven to be one of the lowest costs, highest safety as well as most reliable way. 

HDTX3500 Dual Interface Card Milling, Pulling Out Antenna Coil Machine & HDHF3500 Dual Interface Card Welding, Embedding Machine

HDTX3500 Dual Interface Card Milling, Pulling Out Antenna Coil Machine & HDHF3500 Dual Interface Card Welding, Embedding Machine are for the production of dual interface card. The machines will mill a cavity in card; pull out antenna coil; lift coil; weld dual interface chip with coil; embed chip and then hot and cold pressing.
HDTX3500 & HDHF3500 are two independent machines and can be connected together in straight line. When connected, all production process of dual interface card, includes milling, pulling out antenna coil, welding and embedding can be done in one time running. This advantage can vastly boost production efficiency and yield and can save labor cost and space. The throughput of connected machines can reach 3,500 cards/h.
The HDTX3500 Dual Interface Card Milling, Pulling Out Antenna Coil Machine & HDHF3500 Dual Interface Card Welding, Embedding Machine can be used in not only dual interface card making, but also normal ISO 1 chip in 1 card milling and embedding which is the only type of equipment can do so on the market.

Sequence and introduction of modules
The following table shows all modules in sequence:


HDTX3500 Dual Interface Card Milling, Pulling Out Antenna Coil Machine


 

Pos	Module name	Description
1	Card Input A	With the capacity of 500 ISO cards. Card input unit adopts vacuum system to separate cards, and there is not scratch on sensitive card surface. Blowing system is equipped on front and back to avoid card duplication
2	Card Input B	With the capacity of 500 ISO cards. Card input unit adopts vacuum system to separate cards, and there is not scratch on sensitive card surface. Blowing system is equipped on front and back to avoid card duplication
3	Double card detection A	Double card detection is to protect unnecessary cards from flowing to next progress.
4	Card direction detection A	This function of this unit is to detect target by color sensor. Color sensor will detect the target on card surface or card surface color to check if the card orientation is correct, if not correct the card will be rejected to the bin and operator can set the number of consecutive card to stop the machine.
5	Double card detection B	Double card detection is to protect unnecessary cards from flowing to next progress.
6	Card direction detection B	This function of this unit is to detect target by color sensor. Color sensor will detect the target on card surface or card surface color to check if the card orientation is correct, if not correct the card will be rejected to the bin and operator can set the number of consecutive card to stop the machine.
7	Milling Station A	To mill the P1 cavity. Milling stations adopt independent control, 3 group servo motors for 3 axis movement to drive main axis high speed motor for card cavity milling with alloy's milling tool. Conversion / Change tool Complexity and time = Fast exchange, no special tools required X-Y axis accuracy: ±0.015mm, Z axis accuracy:± 0.010mm, flatness accuracy: ±0.005mm. No damage to antenna. Different cavity can be easily swift and customer can design special size cavity milling by themselves.
8	Cleaning Station A	Adopts brush and vacuum to clean cavity again.
9	Milling Station B	To mill the P1 cavity. Milling stations adopt independent control, 3 group servo motors for 3 axis movement to drive main axis high speed motor for card cavity milling with alloy's milling tool. Conversion / Change tool Complexity and time = Fast exchange, no special tools required X-Y axis accuracy: ±0.015mm, Z axis accuracy:± 0.010mm, flatness accuracy: ±0.005mm. No damage to antenna. Different cavity can be easily swift and customer can design special size cavity milling by themselves.
10	Cleaning Station B	Adopts brush and vacuum to clean cavity again.
11	OCR A1	30k pixels resolution IPD Dalsa vision system to locate the coil.
12	OCR B1	30k pixels resolution IPD Dalsa vision system to locate the coil.
13	pulling out antenna wire A1	Multiaxis (three servo motors) movement to pulling out antenna.        The sticking position, depth and movement trajectory are precisely controlled.        Wire can be pulled out gently without breaking.
14	pulling out antenna wire B1	Multiaxis (three servo motors) movement to pulling out antenna.        The sticking position, depth and movement trajectory are precisely controlled.        Wire can be pulled out gently without breaking.
15	pulling out antenna wire A2	Multiaxis (three servo motors) movement to pulling out antenna.        The sticking position, depth and movement trajectory are precisely controlled.        Wire can be pulled out gently without breaking.
16	pulling out antenna wire B2	Multiaxis (three servo motors) movement to pulling out antenna.        The sticking position, depth and movement trajectory are precisely controlled.        Wire can be pulled out gently without breaking.
17	OCR A2	30k pixels resolution IPD Dalsa vision system to check is the antenna is well pulled out.
18	OCR B2	30k pixels resolution IPD Dalsa vision system to check is the antenna is well pulled out.
19	Milling Station A2	To mill the P2 cavity. Milling stations adopt independent control, 3 group servo motors for 3 axis movement to drive main axis high speed motor for card cavity milling with alloy's milling tool. Conversion / Change tool Complexity and time = Fast exchange, no special tools required X-Y axis accuracy: ±0.015mm, Z axis accuracy:± 0.010mm, flatness accuracy: ±0.005mm. Different cavity can be easily swift and customer can design special size cavity milling by themselves.
20	Cleaning Station A2	Adopts brush and vacuum to clean cavity again.
21	Milling Station B2	To mill the P2 cavity.       Milling stations adopt independent control, 3 group servo motors for 3 axis movement to drive main axis high speed motor for card cavity milling with alloy's milling tool.       Conversion / Change tool Complexity and time = Fast exchange, no special tools required       X-Y axis accuracy: ±0.015mm, Z axis accuracy:± 0.010mm, flatness accuracy: ±0.005mm.       Different cavity can be easily swift and customer can design special size cavity milling by themselves.
22	Cleaning Station B2	Adopts brush and vacuum to clean cavity again.
23	Card output A/card transporting A	Each with the capacity of 500 ISO card. Recommend customer to load maximum 50 cards in the magazine.       Card could be transported to HDHF3500 directly if two machines are connected.       Sensors been equipped here to prevent from hand pinching.
24	Card output B/card transporting B	Each with the capacity of 500 ISO card. Recommend customer to load maximum 50 cards in the magazine.       Card could be transported to HDHF3500 directly if two machines are connected.       Sensors been equipped here to prevent from hand pinching.
25	Reject box	Rejected cards will be collected in this box.       Machine will alarm and stop if the box is full.

HDHF3500 Dual Interface Card Welding, Embedding Machine

Pos	Module name	Description
1	Connected card transporting A &B	To transport cards from HDTX3500 to HDHF3500 directly.
2	Card Input	With the capacity of 500 ISO cards. Recommend customer to put maximum 50 cards in it. Card input unit adopts vacuum system to separate cards, and there is not scratch on sensitive card surface. Blowing system is equipped on front and back to avoid card duplication
3	Double card detection A	Double card detection is to protect unnecessary cards from flowing to next progress.
4	Cavity detection	To detect if the card is milled or not.
5	Wire sticking	Use adhesive tape to sick the wire from card surface to stand up.
6	Wire alignment	To align the wires and make them vertical.
7	Wire cutting	To cut the wires in proper length. Cut wire will be sucked by vacuum.
8	Wire alignment	Final wire alignment before welding.
9	Wire counting	Electrical conductive to count if there are 2 x wires. To check if the wire is well be vertical for welding.
10	Module welding	Punch the module for 6 pin or 8 pin. Pick the module and rotate 90 degrees. Use Mingsen knowhow welding technology to weld two wires simultaneously  with the module in one time. The welding position is super precise and the welding result is tight and enjoys good conduction.
11	ATS detection	To check if the module and wires are well welded.
12	Module alignment	To make the welded module from vertical to be flat.
13	Rejecting	To reject failed welding card.
14	Embedding/ insertion & pre-heating	Pre-heat the welded module and embed it into cavity. Module will be automatically positioned when embedding.
15	ATS detection	To check if the embedded card is OK.
16	Hot press 1, 2, 3	With patented hot and cold pressing technology, chip will not be damaged and embedding result is tight and elegant.
17	Cold press	With patented hot and cold pressing technology, chip will not be damaged and embedding result is tight and elegant.
18	ATR test	Check chip ATR value. With UPP connection.
19	ATS detection	To check if card is OK.
20	OCR	IPD Dalsa vision system for checking the chip position, chip surface.
21	Card output	With the capacity of 500 ISO card. Recommend customer to load maximum 50 cards in the magazine.
22	Reject box	Rejected cards will be collected in this box. Machine will alarm and stop if the box is full.

Software
Software system is in charge of the HDTX3500 & HDHF3500 machine in the aspect of production's control, maintenance and manage, including the monitor of production, the adjustment and collation, the check of IO's statement and log view, etc. By using IO control card, the system gives mechanical part a relevant control, and deals with the alarm of equipment failure, signal adjustment of each movement and so on. It is very convenient for the user to maintain machine's hardware.

Technical parameters

HDTX3500 & HDHF3500
Throughput	Up to 3,500 cards/h in dual interface card making; Or 4,500 cards/h in ISO 1 chip in 1 card milling and embedding.
Total Power	10KW
Power Supply	AC 220~240 V, 50/60Hz
Working temperature	0 - 40ºC
Compressed air supply	0.6-0.8 MPA
Working relative humidity	15-90%
Overall dimensions (L*W*H)	6500×1000×1750mm (in straight line)
Total weight	approx. 3,000kg

<< MINGSEN MANUFACTURES A TO Z SMART CARD PRODUCTION LINE >>

<< CERTIFICATE >>