SIM Card Chip Reel Glue-Tape Lamination Machine

• Customization: Available
• Automatic Grade: Full-Automatic
• Warranty: 1 Year
• Model NO.: HDJ150
• Throughput: 10, 000 PCS/H
• Card Dimension: 86*54*(0.5-1.5)mm
• Total Power: 4kw
• Power Supply: ~220V 50/60Hz
• Ambient Temperature: 0-40degree
• Air Supply: ≥0.5MPa
• Humidity: 15~90%
• out-Line Dimension: 1700×550×1600mm
• Transport Package: Packed in Strong Fumigated Wooden Case
• Specification: CE
• Trademark: Mingsen
• Origin: China
• HS Code: 8479899990
• Production Capacity: 10, 000 PCS/H

Product Description

Feeder---double card inspector---inkjet printing---printing inspection---rotary hot stamping ---card collector



Feature:

• This machine is PLC controlled and it is convenient to operate with easy optional English/Chinese touch screen operation interface.
• Glue punching and lamination enjoys high accuracy.
• Changing between 6 pin and 8 pin glue lamination is convenient.

Stations:

1	IC, glue release: to release IC tape and glue tape.
2	Glue die-cut: to cut square or round hole for 6 or 8 pin chip.
3	Glue-tape lamination: to heat and laminate glue tape at the back side of 6 or 8 pin chip.
4	IC tape leading unit: to drive IC tape.
5	IC tape collecting: to collect laminated IC tape.

 

Technical parameters
Speed	10,000chips/h
Total power	1.5KW
Power supply	~220V 50/60Hz
Ambient temperature	0-40ºC
Air supply	0.6-0.8MPa
Humidity	15~90%
Machine out-line dimension	1700×550×1600mm

 

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