Di Card Milling & Embedding Machine

Product Details
Customization: Available
Throughput: 5000 Cards/H
Card Dimension: 86*54mm
Gold Member Since 2022

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Number of Employees
122
Year of Establishment
2004-04-12
Management System Certification
ISO9001:2015, ISO14001:2015, ISO27001, ISO20000
  • Di Card Milling & Embedding Machine
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Basic Info.

Model NO.
ACF HDMI5000
Card Thickness
0.8+/- 0.2mm
Total Power
10kw
Power Supply
~220V 50/60Hz
Ambient Temperature
0-40 Degree
Air Supply
0.6-0.8MPa
Humidity
15~90%
Transport Package
Packed in Strong Fumigated Wooden Case
Specification
CE
Trademark
Mingsen
Origin
China
HS Code
8479899990

Product Description

Di Card Milling & Embedding MachineThis Milling and Embedding machine is mainly for banking card ACF technology DI card milling and embedding. It can also be used in normal IC card, SIM card milling and embedding. 

Feature:
  • Machine combined the function of cavity milling, chip embedding and contact & contactless encoding together perfectly.
  • Machine is controlled by industrial computer and servo motor. Machine status monitoring, production operation, parameters setting, etc. can be easily achieved by using computer.
  • Changing production type, e.g. from 6 pin to 8 pin, is very convenient. It takes only several minutes to shift between patented 6 & 8 pins chip punching module.
  • Horizontal card unloading unit and card loading magazines both can contain maximum 1000 cards which reduce labor.
  • Machine milling X-Y axis accuracy: ± 0.015mm, Z axis accuracy: 0.015mm and embedding accuracy is ± 0.015mm.
  • Chip embedding employs patent of flexible hot and cold pressing technology, making the embedding result tight and exquisite
  • Machine been equipped with a vacuum to exhaust milling dust and a water chiller to cool machine.
  • Water cooling protected milling spindle, embedding and hot presser enjoy longer life time.
  • The system is composed of three parts: mechanical configuration, electronic control and data processor. All of them with online security monitoring. SDK, DLL (dynamic link library) and application interface are provided for users to develop their own card manufacturing software. And it supports background control, remote data loading, encryption, etc.
  • The machine can run 24 hours×7 days with stable and excellent performance.

Stations/funtions:

Milling Part: 

Card feeding conveyor × 2: each with the capacity of 500 ISO card.
Card orientation detection: to detect card direction.
Card thickness detection × 2: to detect card's thickness.
Milling × 2: X-Y axis accuracy: ±0.015mm, Z axis accuracy: ± 0.015mm, flatness accuracy: ±0.005mm
  • Milling stations adopt independent control, 3 group servo motors for 3 axis movement to drive main axis high speed motor for card cavity milling with alloy's milling tool.
  • Chucks: Suitable chucks for different shaft diameters d = 3, 4, 5 mm
  • Conversion / Change tool Complexity and time = Fast exchange, no special tools required
  • X-Y axis accuracy: ±0.015mm, Z axis accuracy:± 0.015mm, flatness accuracy: ±0.005mm.
  • Different cavity can be easily swift and customer can design special size cavity milling by themselves.
Di Card Milling & Embedding Machine
Cleaning station × 2: to clean milling dust in cavity.
Sampling × 2: to take a sample card for manual checking.
Depth detection unit × 2: to detect cavity depth.
OCR × 2: to detect: to detect if antenna is well milled.

Di Card Milling & Embedding Machine
Antenna continuity detection × 2: to detect antenna continuity.
Card collecting magazine × 2: each with the capacity of 500 ISO card.
Reject box × 1: to collect rejected card.
Chiller × 1: to provide cool water for machine.
Vacuum × 1: a big vacuum cleaner to suck milling dust.
 
Embedding Part:
Connection *1: to connect milling machine with embedding machine, so the two machine can run as one auto line.
Card feeding conveyor × 1: with the capacity of 10000 ISO card.
Double card detection × 1: to detect double card.
Cavity detection ×1: to detect if card been milled or not.
Tape releasing × 1: to release chip.
Chip punching × 1: to punch chip, with 6 pin and 8 pin punching module combined together. Punching accuracy ± 50μm, Cpk>1.33.
Di Card Milling & Embedding Machine

Chip embedding × 1: to embed chip, embedding accuracy ±0.01mm
Module presence detection × 1: to detect if the card been embedded or not.
Hot pressing × 4: to hot press embedded chip.
Cold pressing × 2: to cold press embedded chip.
Chip height detection × 1: to detect chip height.
Vision detection × 1: using OCR to detect chip embedding result.
ATS detection × 1: to detect ATS.
ATR detection × 1: to detect ATR.
Card loading magazine × 2: each with the capacity of 500 ISO card.
Reject box × 1: to collect rejected card.
Chiller × 1: to provide cool water for machine.

 
Technical parameters of Milling and Embedding Line in making ACF DI card
Throughput 4,000 CPH
Standard card size 85.6×54×(0.5-1.5)mm
Total Power 16KW
 


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