High Speed GSM Card Embedding Machine

Product Details
Customization: Available
Automatic Grade: Full-Automatic
Warranty: 1 Year
Gold Member Since 2022

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Number of Employees
122
Year of Establishment
2004-04-12
Management System Certification
ISO9001:2015, ISO14001:2015, ISO27001, ISO20000
  • High Speed GSM Card Embedding Machine
  • High Speed GSM Card Embedding Machine
  • High Speed GSM Card Embedding Machine
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Basic Info.

Throughput
5, 000 Cards/H
Card Dimension
86*54mm
Card Thickness
0.76mm-1mm
Power Supply
~220V 50/60Hz
Ambient Temperature
0-40degree
Air Supply
≥0.5MPa
Humidity
15~90%
Transport Package
Strong Fumigated Wooden Case
Specification
CE
Trademark
Mingsen
Origin
China
HS Code
8479899990
Production Capacity
5, 000 Cards/H

Product Description

High Speed GSM Card Embedding Machine
Mingsen L-shape GSM Card Smart Factory


The Smart Factory is a new invention in the Smart Card making industry. With a master control system controls all subsystems, subsystems combination, real time production coordination, real time production monitoring, real time production QC, throughput buffer and balance can be achieved. It minimized manual work and human influence and reduced circulation, then higher efficiency, better quality and more safety can be ensured. It has been used by world leading card manufacturers worldwide.
The machines in Smart Factory can run together automatically as one line and can also produce independently.

The below Card Smart Factory is for production of ISO GSM card. It can be easily upgraded to 2 chips in 1 card (half card) or 4 chips in 1 card (quarter card) production.  

L-shape GSM Card Smart Factory machines' connection is optional. Without this function, Milling, Embedding, Personalization and Punching machine will be independent machine.

High Speed GSM Card Embedding Machine
Milling Machine station: 
Card unloading conveyor × 2: each with the capacity of 500 ISO card.
Double card detection × 1: to detect accidently feed double card.
Card orientation detection × 2: color sensor to detect card direction.
Milling × 2: X-Y axis accuracy: ±0.015mm, Z axis accuracy: ± 0.015mm, flatness accuracy: ±0.005mm
Cleaning station × 2: to clean milling dust in cavity.
Card loading magazine × 2: each with the capacity of 500 ISO card.
Reject box × 1: to collect rejected card.
Chiller × 1: to provide cool water for machine.
Vacuum × 1: to suck milling dust.


Embedding Machine station: 
Card transporting × 1: to transport card from milling machine to embedding machine.
Card unloading magazine × 1: with the capacity of 500 ISO card.
Double card detection × 1: to detect double card.
Cavity detection ×1: to detect if card been milled or not.
Tape releasing × 1: to release chip.
Chip punching × 1: to punch chip.
Chip embedding × 1: to embed chip.
Module presence detection × 1: to detect if the card been embedded or not.
Hot pressing × 4: to hot press embedded chip.
Cold pressing × 2: to cold press embedded chip.
Chip height detection × 1: to detect chip height.
Vision detection × 1: using OCR to detect chip embedding result.
ATR detection × 1: to detect ATR.
Card loading magazine × 1: with the capacity of 500 ISO card.
Reject box × 1: to collect rejected card.
Chiller × 1: to provide cool water for machine.


Personalization Machine station: 
Card transporting × 1: to transport card from embedding machine to personalization machine.
Card unloading magazine × 1: with the capacity of 500 ISO card.
Double card detection × 1: to detect accidently fed double card.
Card direction detection × 1: a color sensor to detect card direction according to different color.
Chip personalization barrel with 32 readers for ISO card x 1: Mingsen reader. When encoding, there are 32 ISO cards been personalized inside the barrel. When encoding 2 chips in 1 card, there are 16 cards inside the barrel.
Card flip-over × 1: to flip-over card.
Laser No.1: a Mingsen HS 50W fiber laser and smog filter to do laser graphic printing.
OCR (Optional) × 1: to check laser printing result, failed card will be rejected.
Card flip-over × 1: to flip-over card.
Laser No.2: a Mingsen HS 50W fiber laser and smog filter to do laser graphic printing.
OCR (Optional) × 1: to check laser printing result, failed card will be rejected.
Card flip-over × 1: to flip-over card.
Vertical card collecting magazine with the capacity of 500 ISO card x 1

High Speed GSM Card Embedding Machine
personalization barrel
High Speed GSM Card Embedding Machine
card laser graphic printing 
 
 
Card Punching Machine stations:
Card transporting × 1: to transport card from personalization machine to punching machine.
1 x Vertical card feeding magazine, with the capacity of 500 ISO cards.
1 x Double card detection. To detect accidently fed double card.
Punching stations. To punch 2FF, 3FF and 4FF (combined or not combined) in ISO card.
Card collecting magazine: to collect punched independent (1 chip in 1 card) card
1 x Rejecting box to collect failed card.


Throughput of complete auto line: 4,500 ISO card/h





 
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