All in One Milling & Embedding Machine

• Throughput: 4500 Cards/H
• Card Dimension: 86*54mm
• Card Thickness: 0.8+/- 0.2mm
• Total Power: 6kw
• Power Supply: ~220V 50/60Hz
• Ambient Temperature: 0-40 Degree
• Model NO.: HDMI5000
• Air Supply: 0.6-0.8MPa
• Humidity: 15~90%
• Transport Package: Packed in Strong Fumigated Wooden Case
• Specification: CE
• Trademark: Mingsen
• Origin: China
• HS Code: 8479899990

Product Description

This machine is for ISO, 2 chips in 1, 4 chips in 1 SIM Card as well as ACF DI card high accuracy milling & embedding.

Feature:

• Machine combined the function of cavity milling & chip embedding together perfectly.
• Machine is controlled by industrial computer and servo motor. Machine status monitoring, production operation, parameters setting, etc. can be easily achieved by using computer.
• UPP connection is available.
• Changing production type, e.g. from 6 pin to 8 pin, is very convenient. It takes only a couple of minutes to shift between patented 6 & 8 pins chip punching module.
• Horizontal card unloading unit and card loading magazines both can contain maximum 1000 cards which reduce labor.
• Machine milling X-Y axis accuracy: ± 0.015mm, Z axis accuracy: 0.015mm and embedding accuracy is ± 0.015mm.
• Chip embedding employs patent of flexible hot and cold pressing technology, making the embedding result tight and exquisite
• Machine been equipped with a vacuum to exhaust milling dust and a water chiller to cool machine.
• Water cooling protected milling spindle, embedding and hot presser enjoy longer life time.

Stations/funtions:

• Card feeding unit

              2 x vertical fixed magazines
              Each magazine is 500 cards capacity, total 1,000 cards

• Double card detection
• Card orientation detection

              2 x target detection (QR code reader)

• Milling station with chiller

              2 x milling heads

• Card rotation

              Between 2 milling station, rotate the card for other side milling

• Cleaning unit with vacuum cleaner

              Vacuum blowing & sucking system (no damage to cards)
              2 x cleaning stations

• Cavity depth detection (optional)

              2 stations for ISO, 2 IN 1 & 4 IN 1

• OCR detection (optional)

              Vision system for antenna wire detection

• Empty stations

              2 empty stations for Q factor detection (optional)

• Card pick & place

              2 station from milling to embedding

• Embedding unit

              Dual tapes
              Module cutting accuracy of the microcircuit punching: ± 50μm with Cpk>1.33
              Chip pre-heating
              Chip insertion Accuracy can reach ±0.01mm

• Module presence control
• Pressing unit

              4 x hot pressers for left side
              4 x hot pressers for right side
              1 Cold presser

• Card rotation

              Between 1^st and 2^nd hot pressing group

• ATR detection
• ATS detection
• OCR detection

              For ISO card one embedded chip appearance detection.

• Card collecting

              1 x 500 cards capacity

• Reject bin

Technical parameters
Throughput	4,000-4,500 Chips/H depending on hot pressing time
Standard card size	85.6×54×0.5-1.5mm
Standard card thickness	0.1mm min paperboard or PVC.
Total Power	10 Kw
Power Supply	AC 220V, 50/60Hz
Working temperature	0 - 40ºC
Compressed air supply	≥ 0.5-0.8 MPA
Working relative humidity	15-90%
Overall dimensions (L*W*H)	4200×850×1852mm

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