Advanced Chip Cavity Milling Equipment

Product Details
Customization: Available
Automatic Grade: Full-Automatic
Warranty: 1 Year
Gold Member Since 2022

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Number of Employees
122
Year of Establishment
2004-04-12
Management System Certification
ISO9001:2015, ISO14001:2015, ISO27001, ISO20000
  • Advanced Chip Cavity Milling Equipment
  • Advanced Chip Cavity Milling Equipment
  • Advanced Chip Cavity Milling Equipment
  • Advanced Chip Cavity Milling Equipment
  • Advanced Chip Cavity Milling Equipment
  • Advanced Chip Cavity Milling Equipment
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Basic Info.

Model NO.
HDM5000
Throughput
5, 000 Cards/H
Card Dimension
86*54mm
Card Thickness
0.8mm±0.2mm
Total Power
10kw
Power Supply
~220V 50/60Hz
Air Supply
≥0.5MPa
Mbient Temperature
0-40degree
Humidity
15~90%
out-Line Dimension
1900*800*1530mm
Transport Package
Packed in Strong Fumigated Wooden Case
Specification
CE
Trademark
Mingsen
Origin
China
HS Code
8479899990
Production Capacity
5000 PCS/Hour,

Product Description

Advanced Chip Cavity Milling Equipment

 

Product Description

 

This machine, designed by Guangzhou Mingsen Technologies Co., Ltd., is ideal for milling Smart Cards such as IC cards, SIM cards, GSM cards, and banking cards. It is also suitable for ACF DI card cavity milling, with the option to equip the milling station with an ATS (antenna touch system) for DI card cavity milling.



 

Features:

 

  • Two card input modules with vacuum and card sensing systems to detect double or missing cards.

  • Mechanical positioning system for higher accuracy than traditional cylinder systems.

  • High-speed spindle motor with water-cooling system.

  • X Y Z motion control by servo motor for precise accuracy: X-Y axis ±0.015mm, Z axis ±0.015mm, flatness ±0.005mm.

  • Z axis depth adjustment with servo close loop control.

  • Vacuum chamber for dust and shaving removal.

  • Components from international well-known brands for high-quality assurance.

  • PC control for seamless operation.


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Machine Stations/Functions:

 

  • Card unloading magazine x 2 with a capacity of 500 ISO cards each.

  • Double card detection to prevent accidental double feeding.

  • Card orientation detection x 2 for accurate card direction.

  • Milling x 2 with precise accuracy: X-Y axis ±0.015mm, Z axis ±0.015mm, flatness ±0.005mm.

  • Optional ATS (antenna touch system) for enhanced functionality.


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Advanced Chip Cavity Milling Equipment

Enhance milling efficiency with our Advanced Chip Cavity Milling Equipment. Includes 2 cleaning stations for milling dust and 2 depth detection units.

Advanced Chip Cavity Milling Equipment

 

Product Description:

 

Guangzhou Mingsen Technologies Co., Ltd. presents:

 

  • Card loading magazine x 2: each with a capacity of 500 ISO cards

  • Reject box x 1: for collecting rejected cards

  • Chiller x 1: provides cool water for the machine

  • Vacuum x 1: for sucking milling dust


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Optional Functions:

 

  • Thickness detection x 2: checks card thickness

  • Sampling x 2: takes a card after milling as a sample

  • Milling with antenna touch system (ATS) for dual interface card

  • Milling through detection x 2: detects if the cavity has been milled through


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Experience a complete smart card production line with Mingsen!



 Advanced Chip Cavity Milling Equipment
Advanced Chip Cavity Milling Equipment
Advanced Chip Cavity Milling Equipment
 
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Advanced Chip Cavity Milling Equipment

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